Eliyan Raises $145 Million Series C, Reaches $1 Billion Valuation for AI Chip Interconnect Technology

Eliyan Secures $145 Million in Series C Funding

Silicon Valley-based Eliyan has raised $145 million in an oversubscribed Series C funding round, achieving a $1 billion valuation.

The round was led by Seligman Ventures, with participation from new strategic investors Cisco Investments and Lumentum.

As part of the investment, Umesh Padval, Managing Partner at Seligman Ventures, has joined Eliyan's board of directors.

Building High-Speed Connectivity for AI Infrastructure

Eliyan develops electro-optical interconnect technologies that connect compute, memory, and networking components inside AI data centers.

Its portfolio includes:

• NuLink PHYs

• NuGear chiplets

These technologies provide:

• Die-to-die connectivity

• Chip-to-chip connectivity

• Rack-to-rack connectivity

The company aims to improve bandwidth and power efficiency as AI infrastructure scales to support larger training and inference workloads.

According to the company, traditional system connectivity approaches are becoming a bottleneck as compute, memory, networking, and advanced packaging become increasingly interconnected.

Funding to Accelerate Product Development

Eliyan said the new funding will be used to:

• Advance research into faster interconnect technologies

• Scale manufacturing

• Expand its partner ecosystem

• Accelerate product development and customer adoption

CEO Ramin Farjadrad said the investment positions the company to expand its technology and ecosystem as demand for AI infrastructure continues to grow.

The company also stated that its technology is currently being evaluated or deployed by several hyperscalers, AI accelerator developers, and memory chip suppliers, although it did not disclose customer names.